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Kuayue HCH potting and encapsulating compounds consists of epoxies and silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength, thermal conductivity and excellent chemical resistance. HCH potting and encapsulating compounds provide reliable long term performance for microelectronic, electronic, electrical devices, components including:
Physical Properties: |
PROPERTY | HCH080 | HCH100 | HCH150 | HCH200 |
Color | A:Gray B:Lucency | A:Gray B:Lucency | A: White B: White | A: White B: White |
Mix Ratio by Weight | 10:1 | 10:1 | 1:1 | 1:1 |
Hardness | 60°C Shore C | 60°C Shore C | 75°C Shore C | 75°C Shore C |
Adhesiveness | 5000cps | 5000cps | 5000cps | 5000cps |
Pot Life (Hour, 25°C) | 1H | 5H | 0.5H | 1H |
Room Curing Time | 2H | 24H | 1H | 2H |
Cured Density | 1.7 | 1.7 | 1.7 | 1.7 |
Thermal conductivity | 1.0 W/M-K | 1.0 W/M-K | 1.0 W/M-K | 1.0 W/M-K |
Shelf Life | 12 months under 25°C with sealed container. | |||
Standard Packing | 1kg/tin; 150g/tube |
Features:
HCH series is the one component thermal conductive glue, applied in the firm tack conjunction between the electronic components and other device materials. It is in speedy consolidation under normal temperature with superior tacky , exceptional electrical isolation, splendid seal and remarkable heat dissipation performance, which also is durable among the temperature from -60 Celsius to 250 Celsius.
Range of applications:
1.The utility model can be used for sealing, packaging, insulation and moisture-proof electronic or other products;
2.Widely used in transformers, AC capacitors, high pressure packs, negative ion generators, aquarium pumps, ignition coils, power modules, electronic controllers and other electronic components;
3.Not suitable for flexible or soft shell products.
Applications
·Switches
·Ignition coils
·Electronic modules
·Motors
·Connectors
·Sensors
·Cable harness assemblies
·Capacitors
·Transformers
·Rectifiers
Company Information:
Dongguan Kuayue Electronic Co., Ltd. is a high-tech enterprise which specializes in research & development, production and sale electronic thermal conductivity material. Our company is located in a convenient place near the exit of Shilongzi Expressway.
High-performance thermal conductivity silicon pads, thermally conductive gap filling materials, graphite sheets, thermal conductive adhesives, thermally conductive insulation pads, soft silicon thermally conductive pads, phase change materials and silicone products are produced in our company. They are widely used in power supply, LCD/PDP TVs, LED lights, car electronics, photoelectricity, computers and so on. We have top-notch engineer team and experienced marketing workers for the product development, research and marketing, so we can support our customers with idiographic solution & technology support.
In order to satisfy customers' demands, we have set up the cooperative relationships with famous graduate schools in China & thermal material factories abroad. Our aim is "abundant products, perfect quality, competitive price, reasonable profit & best service".
"Regard customers as our center" is our management tenet. We will offer excellent quality and superior service to our new and old partners.
Model | HCH080 | HCH100 | HCH150 | HCH200 | |||||
Components | A | B | A | B | A | B | A | B | |
Before curing | Appearance | Black | White | Black | White | Black | White | Black | White |
Viscosity(cps) | 4000 | 4500 | 5000 | 5500 | |||||
Operating performance | Using the proportion | 1:1 | 1:1 | 1:1 | 1:1 | ||||
Mixed viscosity(cps) | 4000 | 4500 | 4500 | 5500 | |||||
Operational time(min) | 60-120 | 60-120 | 60-120 | 60-120 | |||||
Curing time(min) | 480(25℃) | 480(25℃) | 480(25℃) | 480(25℃) | |||||
Heat curing(min) | 20(80℃) | 20(80℃) | 20(80℃) | 20(80℃) | |||||
After curing | Hardness(shore A) | 60±5 | 60±5 | 60±5 | 70±5 | ||||
Temperature range(℃) | -60~200 | -60~200 | -60~200 | -60~200 | |||||
Dielectric constant(1MHZ) | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | |||||
Volumetric resistivity(Ω.cm) | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | |||||
Coefficient of expansion(m/m.k) | ≤2.2×10-4 | ≤2.2×10-4 | ≤2.2×10-4 | ≤2.2×10-4 | |||||
Flame retardant(UL94) | V0 | V0 | V0 | V0 | |||||
Thermal conductivity(W/m.k) | 0.8 | 1.0 | 1.5 | 2.0 |